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SAN JOSE, Calif., March 12, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate its 7nm FinFET-class SerDes IP product at OCP 2019.
SerDes Demonstration: Samtec booth at OCP, San Jose Convention Center
March 14-15, 2019
Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm, 56G PAM4 and NRZ DSP-based long-reach SerDes.
The demonstration will drive four high-speed SerDes lanes in three configurations:
Real-time data associated with all channels will also be displayed to demonstrate the robustness and low power of the device, including:
March 14-15, 2019
San Jose Convention Center
San Jose, Calif., USA
The 2019 Open Compute Project (OCP) Global Summit brings together more than 3,400 key decision makers, executives, engineers, developers and suppliers. Together, they help grow, drive and support the open hardware ecosystem in, near and around the datacenter and beyond.
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com
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|Sally Slemons||Nanette Collins|
|eSilicon Corporation||Public Relations for eSilicon|