Loading, Please Wait...
SAN JOSE, Calif., Nov. 11, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement to acquire eSilicon’s embedded memory (SRAM, TCAM, multi-port memory compiler) and interface (HBM and HBI™) IP assets.
“I am delighted with these transactions from Inphi and Synopsys, two extraordinary companies in their markets. Our engineering talent, IP and customer relationships in networking, data-center and cloud, telecom 5G infrastructure and AI will help enhance their respective offerings,” said Jack Harding, president and CEO of eSilicon. “I thank all our customers, employees, partners and investors for the unwavering support and commitment they have provided eSilicon over the years.”
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com
Collaborate. Differentiate. Win.™
eSilicon is a registered trademark, and the eSilicon logo, neuASIC, HBI and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
|Sally Slemons||Nanette Collins|
|eSilicon Corporation||Public Relations for eSilicon|