Loading, Please Wait...
SAN JOSE, Calif., Sept. 19, 2019 (GLOBE NEWSWIRE) -- In a release issued under the same headline today by eSilicon Corporation, please note that in the headline of the release, it should be Seven-Meter and Five-Meter Samtec Cable Assemblies, not Seven-Meter and Three-Meter as previously stated. Additionally, in the third paragraph, it should be two 67cm AcceleRate® Slim Body Cable Assemblies, not 0.670cm as previously stated. The corrected release follows:
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Five-Meter Samtec Cable Assemblies
eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, and Samtec, a leading global manufacturer of electronic interconnect solutions, will demonstrate eSilicon’s 7nm 58G DSP-based PAM4/NRZ SerDes capabilities for two challenging data center applications including an industry-first use of a seven-meter cable assembly from Samtec.
eSilicon and Samtec have co-developed system-level solutions that emulate next-generation data center architectures for typical 19-inch rack-mount applications.
In the first application, eSilicon will demonstrate its SerDes operation over two 67cm AcceleRate® Slim Body Cable Assemblies and a five-meter (16-foot) ExaMAX® Backplane Cable Assembly providing mid-board to backplane communications via a cabled backplane architecture from Samtec. This demonstration highlights eSilicon’s SerDes architecture’s flexibility in supporting independent data rates and protocols on each individual lane, e.g., 50G PAM4 Ethernet, 24G NRZ CPRI and proprietary protocols up to 58Gb/s.
In the second application, eSilicon will demonstrate rack-to-rack communications using ExaMAX® Backplane Connector paddle cards and a seven-meter (23-foot) ExaMAX Backplane Cable Assembly. This demonstration shows the performance, robustness and extremely low power consumption of eSilicon’s 7nm 58G PAM4 and NRZ full-DSP long-reach SerDes in an extreme-use case featuring a total insertion loss of 45dB bump to bump.
A broad set of monitoring and diagnostic tools are available through eSilicon’s SerDes evaluation module kit and its graphical user interface to control, observe and analyze signal quality and performance metrics across the link in real time, including:
Where & When
eSilicon Booth 650
The ECOC Exhibition is the largest optical communications exhibition in Europe, held each September in a different European city. ECOC 2019 is the key meeting place for decision makers from across the fibre optic communications technology industry.
Founded in 1976, Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ locations serving approximately 125 countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit www.samtec.com.
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 58G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com
Collaborate. Differentiate. Win.™
eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
|Sally Slemons||Nanette Collins||Matthew Burns|
|eSilicon Corporation||Public Relations for eSilicon||Samtec|